Winmate Showcase Industrial Mobile Computers
at PACK Expo International 2022

PACK EXPO International 2022

October 23-26, 2022

Chicago, IL
McCormick Place, 2F East Building Lakeside Center Booth LL-9510
Website: https://www.packexpointernational.com/

Winmate will showcase rugged computers for manufacturing and warehouse industries at the PACK EXPO International 2022 booth LL-9510, 2F East building lakeside center, McCormick Place Convention Center, Chicago on 23-26 October 2022.

Explore the latest trends in Winmate's enterprise mobility technology and discover our moves towards industrial automation and successful applications. Winmate's booth will feature various industrial and rugged mobile computers solutions. From industrial panel PCs, HMIs, Industrial box PCs, rugged tablets, PDAs, and rugged laptops that aim to develop agile, efficient operations and meet your business needs of technology.

We look forward to seeing you at the booth!